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Date: | Wed, 17 Feb 1999 11:39:04 -0600 |
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From: Dennis J Fall@TFT on 02/17/99 11:39 AM
To: [log in to unmask]
cc:
Subject: Plating solder onto isolated areas
I have been trying to find a way to plate solder onto isolated area on a
substrate. I need anywhere from 4-25 microns of solder covering copper
pads that are isolated from any other metal. So, electroplating may be
possible, but it is a matter of finding out how to do this. If there are
any ideas, please respond.
Thank You,
Dennis Fall P: 507-625-8445 x17
Engineer F: 507-625-3523
Thin Film Technology Corporation mailto:[log in to unmask]
1980 Commerce Drive http://www.thin-film.com
North Mankato, MN 56003-1702
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