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Reply To: | TechNet E-Mail Forum. |
Date: | Sat, 13 Feb 1999 10:27:13 +0800 |
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Actually, I have try 4 runs of sample by Omikron process in Taiwan and
I found that solderability performance is very poor. Nobody can help me
to solve this trouble issue immediately.I maybe get something wrong, or
the Omikron process get homesick in Taiwan.
Howard
> -----原始郵件-----
> 寄件者: [log in to unmask] [SMTP:[log in to unmask]]
> 傳送時間: 1999年2月12日 AM 02:13
> 收件者: [log in to unmask]
> 主旨: Re: [TN] Immersion Tin
>
> Rudy,
> This is the response I sent to Les.
>
> Les,
> What kind of tin immersion bath are you questioning? I work with
> the
> Omikron White Immersion Tin. In the case of Omikron you would keep
> the copper
> concentration under 4,000 ppm. In most cases under normal use the
> concentration will stay below 1,000.
> If you cool the bath and filter it with a one micron filter you
> will find
> the bath stays within limits fairly easy.
>
> Stephen M. Wentz
> Florida CirTech
>
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