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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 12 Feb 1999 14:25:22 -0500 |
Content-Type: | text/plain |
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Has anyone done a study on the correlation of board reliability vs. the number
of heat cycles a board sees? Particularly, if a board has been through 2 smt
processes and wavesolder, how much smt rework can one do to the board and still
feel confident that the product won't fail in the field? I'm especially
interested in large boards, .100" thick, 18 layer, OSP finish.
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