Dear TN,

     I am looking for a white paper or perhaps an article on the effects of
     gold volume to solder reflow reliability.  Apparently NCMS had an
     article in ~spring of '96, co-authored by Wenger and Janus,
     determining that 3% was an allowable percentage.

     If you know how I can find this paper I would appreciate it.  If you
     know of more recent studies that might help as well.

     Thank you, Rich.

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