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February 1999

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TechNet <[log in to unmask]>
X-To:
"Carano,Michael" <[log in to unmask]>
Date:
Thu, 18 Feb 1999 10:41:43 -0500
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Dave Hoover <[log in to unmask]>
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Subject:
Re: Galvanic reactions
From:
Dave Hoover <[log in to unmask]>
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McCurdy Circuits
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text/plain (25 lines) 
Michael also keep in mind that a gold finish is smoother than solder.
The etchant will move across faster and tend to puddle less on gold.
The solder has more surface topology and tends to puddle more and
require more time through the etcher.

Just my observations......

I've also seen solutions with Thiorea create strange galvanic situations.
It sometimes generates some energy that can deplate and replate
in some of the strangest situations. <Gremlins again>

Groovy

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