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January 1999

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Subject:
From:
Paul Wilson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Jan 1999 15:35:01 -0500
Content-Type:
text/plain
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text/plain (103 lines)
Kelly,

Of course, CCI manufactures boards using Omikron as a surface finish too.

In order to defray an onslaught of anti-sales comments, I believe we make
the better boards, but there are 40 shops or so around who can put on the
finish.

Contact Stephen Wentz of Florida CirTech -- [log in to unmask] -- for a
manufacturer list or come to us.

Regards,

                        Paul Wilson
        R&D Manager / Plant Chemist

                   Circuit Center, Inc.
                 4738 Gateway Circle
                  Dayton, OH 45440

          Phone (937) 435-2131     Fax (937) 435-7698
            http://www.circuitcenter.com


-----Original Message-----
From:   Keith Larson [SMTP:[log in to unmask]]
Sent:   Thursday, January 07, 1999 3:01 PM
To:     [log in to unmask]
Subject:        Re: [TN] immersion white tin finish

Hi Kelly,

I know of two manufacturers off hand. Data Circuit Systems (small shop, low
to med tech, low to med volume,
some QTA) and Power Circuits (med size fabricator, high tech including
microvias, QTA protos through QTA
production) both have the Omikron White Tin in house.

Best regards,

Keith Larson


KELLY M SCHRIVER wrote:

> Hi All -
>
> We are in the process of evaluating alternates to HASL for surface mount
> boards.  Most of our designs are targeted for severe operating
environments,
> including military.   This evaluation includes the Omikron White Tin.  It
is
> premature to say very much, other than the white tin seems to be the only
one
> of the several finishes, other than HASL, which retains full
solderability
> thru storage and multiple solder/cleaning process cycles.  Evaluation has
not
> yet reached the point of limited production and no product has yet been
> subjected to ESS and beyond.
>
> I would make the following observations: This finish is very flat and
uniform,
> free of the crowns which sometimes add to the problems of fine pitch and
BGA
> assembly.  It is also lead free, for the point in time that we are faced
with
> that issue.
>
> The only shortcoming to date is that a very limited number of board
> fabricators have the process up and running.
> Regards - Kelly
>
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