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January 1999

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Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Jan 1999 13:33:00 -0500
Content-Type:
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text/plain (32 lines)
Hi All -

We are in the process of evaluating alternates to HASL for surface mount
boards.  Most of our designs are targeted for severe operating environments,
including military.   This evaluation includes the Omikron White Tin.  It is
premature to say very much, other than the white tin seems to be the only one
of the several finishes, other than HASL, which retains full solderability
thru storage and multiple solder/cleaning process cycles.  Evaluation has not
yet reached the point of limited production and no product has yet been
subjected to ESS and beyond.

I would make the following observations: This finish is very flat and uniform,
free of the crowns which sometimes add to the problems of fine pitch and BGA
assembly.  It is also lead free, for the point in time that we are faced with
that issue.

The only shortcoming to date is that a very limited number of board
fabricators have the process up and running.
Regards - Kelly

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