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January 1999

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Jan 1999 08:49:17 -0600
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HI Seth - take a look back in the TechNet archives - it contains a couple
of discussions on immersion tin and whisker phenomena.

Dave Hillman
Rockwell Collins
[log in to unmask]





Seth Goodman <[log in to unmask]> on 01/05/99 04:08:32 PM

Please respond to [log in to unmask]

To:   [log in to unmask]
cc:
Subject:  [TN] immersion white tin finish




In looking for alternatives to HASL finished boards, several suppliers have
mentioned immersion white tin.  Since it is a conductive surface, whereas
OSP is not, the finished board can be electrically tested.  My question
concerns tin whisker growth.  Is this a problem for a chemically deposited
finish like this, or does this only occur with electroplated tin finishes?

What kind of experiences or opinions do folks have concerning immersion
white tin compared to OSP and immersion gold over nickel?

Seth Goodman
Goodman & Associates
7687 Leta Way
Verona, WI 53593
Tel (608)833-9933
Fax (608)833-9966

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