Dear Technetters,

We are designing a panel layout for a small PWB assembly (1.6" x 2") which
has through-hole components mounted very close to the board edge, leaving
no margin for our usual depaneling process. We usually pre-score the board
and depanel with rotary-blade type splitter. We considered hand-splitting
in this case but we worry about cracking the SMD's on the bottom. Can
somebody enlighten me if there are any methods, tools or equipment for
depaneling in this case?

For your information, the PWB material is FR2, single-sided, 1mm or 1.6mm
thick. Topside is all though-hole devices of 18mm max. height. Bottom side
is all SMD's of 1.2mm min. clearance to the board edge.

Thanks!
KK Chin
Artesyn Technologies
(510)683-6497

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