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January 1999

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Wed, 6 Jan 1999 13:43:41 -0600
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This has been an intersting excursion. Les, Kelly, James, and all have provided some valuable input
to an increasingly (all over again) vital issue.

In retrospect, I just tried to keep it simple by suggesting it is easier to get the heat out without
solder plugging or any other type hole filling. Preventing solder plugging is a little difficult,
but maybe not as much as thermal conductive material hole plugging. I simply opt for simple - as
long as it's efficient and effective. This brings the question concerning what is needed.

James said it right when he suggested performing the experiment. I think I might have mentioned the
need but not the method.

I visited some of my old college text books and early thermal designs and applications for airborne,
and ground based electronic equipment. My thinking may be a bit dated but still gets some heat out.
Then, I made the mistake of visiting what's new since pre-history. The web is like Las Vegas lit up
with so many new studies, papers, articles, and books concerning convection, conduction, and
radiation. It's getting hot both in climate and in electronics - all over again.

With great respect for you all,

Earl Moon

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