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January 1999

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Subject:
From:
Wade Oberle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 Jan 1999 16:04:13 -0600
Content-Type:
text/plain
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text/plain (70 lines)
Richard,
        I am a contract manufacturer and I use some forms of solder
paste inspection.  Are you interested in solder height or print quality
or weight of what.  We use 2-D inspection as part of our MPM UP-3000
system.  We primarily check the fine pitch devices to make sure we are
getting a good print.  We also use a cyber-optics system during set-up
of the screen printer and for trouble shooting when we are unsure of the
height of the print.  We use 6 mil thick stencils for all products.
Depending on how the printer is set-up, we could get from 5.5 to 7.8
mils of solder paste.  Obviously our goal is 6 mils of paste if we are
using a 6 mil stencil but as we all know, it isn't a perfect world.

If you can be more specific on what you are looking for I may be able to
provide more details on why, etc.

Regards,

Wade Oberle

        -----Original Message-----
        From:   Hamilton, Richard -4454 [SMTP:[log in to unmask]]
        Sent:   Monday, January 04, 1999 11:17 AM
        To:     [log in to unmask]
        Subject:        [TN] Solder Paste Application

        Happy New Year TechNetters,

        Well, it is a new year and we want to try something new. I am
interested in
        information and experiences on measuring the paste that has been
applied;
        what equipment, difficult/easy for operators, benefits of use,
etc.

        When you reply and if you are a CM, knowing that would be
helpful.

        As in the past, thanks for any info in advance.

        Richard Hamilton
        Clemar Mfg. / Rain Bird
        [log in to unmask]

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