Hi Earl Moon !

Did you check your G-200 ?  We are confident that your solder joints are
more than perfect !!!

By the way, this pinhole problem as per IPC is within specification but is
a "non-conforming process indicator"...
For us, the difference between a pinhole and a blowhole is that a blowhole
clearly shows that there was outgasing and gas came out of the hole while
pinhole is only a little hole in the solder.
Can we say that a pinhole is the same as a blowhole but less critical
???...We taught that it was 2 different problems.
We think that the root cause might be different between a blowhole and a
pinhole.  We baked the boards and still have pinhole...it did not make any
difference...that is why we think it is not a moisture or gas escape problem.
Could it be a process issue ?

Annie


At 09:25 AM 1/6/99 -0600, you wrote:
>Annie,
>
>Next to my favorite main board manufacturer (Tyan), Matrox is my (and so
many others) favorite
>graphics card maker. To hear you are having these difficulties makes me
run to my G-200 and check
>the solder joints, on the one hand, and congratulate you for your honesty
and courage on the other.
>
>I will send you a couple of pretty/ugly pictures as x-sections, if you
like, showing some
>possibilities. Moisture may be an issue. Other issues may include glass
fiber protrusion into plated
>hole walls (not effectively removed after etch back) acting as a conduit
for gas escape while also
>reducing plating thickness below that specified.
>
>With that much copper inside the MLB, you and your fabricator might be
experiencing other problems.
>For you, as you well know, there is a serious thermal barrier to effective
solder process
>management. Plating quality/thickness, or?, may play a part. Other issues
might include certain
>laminate conditions as micro voiding or larger than specified voids in the
thermal evaluation area.
>However, I would bet you are using a very good fabrication facility that
could render much help.
>
>Are you using quality conformance test circuitry? How do your x-sections
look as received and after
>thermal stress?
>
>Keep up the good work and I can't wait to see what this product turns out
to be,
>
>Earl Moon
>
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