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January 1999

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Jan 1999 09:31:16 -0800
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text/plain (59 lines)
Meaning OSP bare boards are not being tested before shipment to customer by
fab house?

Can anyone explain this? I am currently going through proto run and would
like to more about OSP.

re,
Ken Patel

At 04:08 PM 1/5/99 -0600, Seth Goodman wrote:
>In looking for alternatives to HASL finished boards, several suppliers have
>mentioned immersion white tin.  Since it is a conductive surface, whereas
>OSP is not, the finished board can be electrically tested.  My question
>concerns tin whisker growth.  Is this a problem for a chemically deposited
>finish like this, or does this only occur with electroplated tin finishes?
>
>What kind of experiences or opinions do folks have concerning immersion
>white tin compared to OSP and immersion gold over nickel?
>
>Seth Goodman
>Goodman & Associates
>7687 Leta Way
>Verona, WI 53593
>Tel (608)833-9933
>Fax (608)833-9966
>
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______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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