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January 1999

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From:
Ryan Jennens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Jan 1999 09:28:34 -0500
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Earl-

        We have been using VOC-free flux for about a year now with few problems.
We are using Alpha's NR310 series, for dual waves, and an Electrovert
Econopack II SMT.  We almost always use the dual waves to help fillet the
tighter toleranced through-hole parts and drive the flux completely away,
but we also almost always use a selective soldering pallet.  We prefer to
reflow bottom side surface mounts.  This has been working as well as the
IPA-based, water cleaned, 856 from Alpha which we switched from.  We had
some problems at first, but after fighting with the process we tightened it
up and found the combination that works.  I will be honest and say that very
slight variations in any settings can have seemingly dramatic effects on
quality.  For instance, changing the solder pot temperature from 460F to
490F gave huge improvements in topside fillets, overall joint quality.  This
is all done using the recommended profile.
        It seems that each new release from the flux manufacturers does a better
job than the last.  I am eagerly awaiting the next to see if we can get a
larger process window.

Ryan Jennens
Phoenix Engineering Design
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
> Sent: Wednesday, January 06, 1999 4:33 AM
> To: [log in to unmask]
> Subject: [TN] Water contents in no clean flux
>
>
> Evan said a bunch without saying it all. I am curious about your
> VOC free experiences as mine have
> been exciting - though mostly positive under certain conditions.
>
> As we're all faced with the prospect of using VOC free, sooner
> than later, I took notice of your
> simple statement concerning the need for a different profile (to
> dry the flux) before the solder
> pot. I've not been able to simply change make the stuff work as a
> no clean type.
>
> About two years ago, using a retro-fitted (with hot air knives)
> TD/NuEra machine, we achieved
> promise removing the oxygen "bubbles" associated with VOC free no
> clean as part of its water
> component. Still, there was some concern with appearance as if
> the no clean didn't - not
> withstanding mild "explosive" activity causing some solder balling.
>
> Using a retro-fitted machine with N2, the result were much
> better. Using a "from the ground up"
> machine with N2, everything started coming together. One
> particular machine offers considerable
> promise (name witheld) as many others will in time.
>
> Evan, could you shed more light on the subject as it is becoming
> much more important now,
>
> Earl Moon
>
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