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January 1999

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Subject:
Re: Removal of Lead
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Jan 1999 14:49:47 EST
Content-Type:
text/plain
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text/plain (26 lines) 
Hi Bob,
The ITRI report not withstanding, David Whalley  is correct that the
reliability of these Sn/Pb solder replacements has not been demonstrated, and
is in fact in question from the sparse data available. Intermetallic layer
formation is not an appropriate indicator of reliability.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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