TECHNET Archives

January 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jodi Eitner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Jan 1999 11:49:51 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Our immersion gold process plates electroless nickel 100-200 microinches and
gold 2-8 microinches. Any increase in the gold thickness (greater than ten
microinches) causes problems in the nickel layer. In our process, the
palladium is used to activate the copper surface before nickel plating
(electroless nickel, 6-8%P), but we do plate any palladium after nickel.

Jodi Eitner
Process Engineer (Immersion Gold, Entek, Tab Plate, HAL)
Compeq International
Salt Lake City, UT

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2