Hello NEODC Members

        I thought everyone would like to know exactly what is going on this meeting.
        As you know I could not talk one of the half dozen CAD vendors into doing a
presentation for us this meeting so vendor nite was scrubbed.
        Instead we have something better, Bob Popielski (Sales), and Dave Wolf (AE) will
be doing a presentation that covers material listed below as well as multi-layer construction,
fabrication notes and documentation.  Will be having pizza and soda this meeting so arrive
early and RSVP.

                        1.  Design for Manufacturability
                                a.  line widths
                                b.  hole sizes
                                c.  board dimensions
                                d.  surface finishes
                                e.  pad to hole relationships

                        2.  Technology Updates
                                a.  Micro vias (less than .008")
                                        1.  Laser
                                        2.  Photo defined
                                b.  High Speed Laminates
                                        1.  Teflon, Rogers etc...
                                c.  Embedded capacitance
                                d.  Embedded resistance
                                e.  Planar magnetics
                                f.  Sequential lamination
                                g.  Hybrid lamination (different core
                                    materials in one pcb construction)
                                h.  Rigid Flex construction


Name: Dave Artman
Company: Pepperl+Fuchs, Inc.
Phone: 330-425-3555
Fax: 330-425-4607
E-Mail: [log in to unmask]

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