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January 1999

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Wed, 6 Jan 1999 03:32:44 -0600
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Evan said a bunch without saying it all. I am curious about your VOC free experiences as mine have
been exciting - though mostly positive under certain conditions.

As we're all faced with the prospect of using VOC free, sooner than later, I took notice of your
simple statement concerning the need for a different profile (to dry the flux) before the solder
pot. I've not been able to simply change make the stuff work as a no clean type.

About two years ago, using a retro-fitted (with hot air knives) TD/NuEra machine, we achieved
promise removing the oxygen "bubbles" associated with VOC free no clean as part of its water
component. Still, there was some concern with appearance as if the no clean didn't - not
withstanding mild "explosive" activity causing some solder balling.

Using a retro-fitted machine with N2, the result were much better. Using a "from the ground up"
machine with N2, everything started coming together. One particular machine offers considerable
promise (name witheld) as many others will in time.

Evan, could you shed more light on the subject as it is becoming much more important now,

Earl Moon

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