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January 1999

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Subject:
Re: Design considerations for No-Clean processes -Reply
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Jan 1999 10:57:11 -0800
Content-Type:
text/plain
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text/plain (26 lines) 
Franky

To decode Stevy's and Andy's wacky comments;
Temper  solderpate stencil apertures until you get no more
solder balls.  You will lose mfg's guarantee.
And keep one PCB vendor and one component vendor for
consistent solderability, and let your vendors deliver your stuffs in
JIT when you need them.  When you get solderability problem,
you know where to point a finger at,
And keep those tempting hands off from PCB's and
components.  You probably need to invent a new process.

Matty,

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