Frank

I think what David did almost say is the SIR specs you derive from the
standards you are obliged to work to .
For general work even with coating the no clean will do you fine ( say up to
class 2 ) ;
however each application sector 's got usually it's own set of standards to
adhere to ;
being h/volume OEM sounds general IPC/ANSI standards I'd say you have
already .
The SMT no clean obviously being that much cleaner than PTH no clean .
To sum it up you should have no general reasons for design considerations
(especially on SMD) in consumer category .

If you'd be a contract house I'd tell more .

See you

Paul Klasek
http://www.resmed.com

> ----------
> From:         Kimmey, Frank[SMTP:[log in to unmask]]
> Sent:         Thursday, 28 January 1999 1:12
> To:   [log in to unmask]
> Subject:      [TN] Design considerations for No-Clean processes
>
> Here is one for the Design and Assembly folks.
> We are a high volume OEM of consumer electronics.
> My Assembly has converted to a No-Clean process.
> What are the differences that I should be concerned with at the design
> level?
> Should I have concerns about or modify any designs left over from the
> Aqueous days?
> Thanks for the help
> FNK
>
>
> Frank N Kimmey, C.I.D.
> EM Designer
> C & K Systems, Inc.
> 916-353-5366
> [log in to unmask]
>
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