Hi Frank - one area of concern that you should investigate is the
cleanliness of your printed wiring boards and the components. In the past,
a large portion of the electronics industry was cleaning electronic
assemblies with an emphasis on flux residue removal (ok, all those folks
who were doing no clean processing don't get me too toasty). Assemblies
went into cleaning systems dirty and came out clean - not only were flux
residues eliminated but board fabrication residues, shipping/packaging
material residues, in plant handling residues, processing residues (e.g
fusing fluxes, bake/cure outgas materials, hand oils, insertion/onsertion
residues) - see where this is going! The flux residue cleaning emphasis
also eliminated a large number of other residue types from sources that
most folks never considered. Take a look at your process from womb-to-tomb
to identify possible residue sources that may cause problems. Good luck.

Dave Hillman
Rockwell Collins
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"Kimmey, Frank" <[log in to unmask]> on 01/27/99 08:12:45 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Kimmey, Frank" <[log in to unmask]>

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cc:
Subject:  [TN] Design considerations for No-Clean processes




Here is one for the Design and Assembly folks.
We are a high volume OEM of consumer electronics.
My Assembly has converted to a No-Clean process.
What are the differences that I should be concerned with at the design
level?
Should I have concerns about or modify any designs left over from the
Aqueous days?
Thanks for the help
FNK


Frank N Kimmey, C.I.D.
EM Designer
C & K Systems, Inc.
916-353-5366
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