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January 1999

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Subject:
From:
Phil Hersey <[log in to unmask]>
Reply To:
Phil Hersey <[log in to unmask]>
Date:
Wed, 27 Jan 1999 17:13:01 -0800
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Has anyone experience with ball bonding to pure silver?  A thickfilm expert
told me he tried it one time, thermal cycled the heck out of it, and the
bond got stronger!  He had no idea why silver was not used for ball bonding.
Aluminum and gold are the only metals I know of commonly used for
thermosonic ball bonding.

If silver works, maybe I can convince my microvia PCB fabricator to install
a silver bath- cheap'r 'n gold!

Phil Hersey, Hytek Microsystems

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