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January 1999

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Subject:
seeking aluminum wedge bonding advice
From:
Phil Hersey <[log in to unmask]>
Reply To:
Phil Hersey <[log in to unmask]>
Date:
Wed, 27 Jan 1999 16:28:21 -0800
Content-Type:
text/plain
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text/plain (25 lines) 
I just found out that I can replace a $120 LTCC substrate with a $1.95
microvia PCB.  Trouble is the PCB comes with nickel/flash gold so cannot be
wire bonded using our gold ball bonding equipment.  Evidently it can be
bonded using ultrasonic aluminum wedge.  This MCM has over 700 wires in a
1.5"x1.5" area (one of the ASIC's has 220 wires itself)- military
application.

Does anyone have experience with al. wedge on such boards?  Construction is
175C Tg FR4 core with 3 layers of photovia on top (photoimageable epoxy
plated up with copper).  Will it work?  Who makes the best bonder?

Phil Hersey, Hytek Microsystems

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