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January 1999

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Subject:
From:
Wade Oberle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Jan 1999 08:57:24 -0600
Content-Type:
text/plain
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text/plain (101 lines)
Gary,
        Here are some answers to your questions:
The overall singulated unit size is 1.3" by 0.4".  There are 4 chip caps
per side and they are all the same part number.  They each measure 0.25"
wide by 0.23" long termination to termination by 0.09" tall.  There are
also two connectors on each board.  There are score lines on all four
sides of the part and the score lines are about 0.02 to 0.035" from the
solder joints.  We have separated these units with our 'pizza cutter'
and feel there is no mechanical damage but the customer won't accept
this for some reason.  We operate on the strict policy that the customer
is always right and don't question their judgement.  This is great for
customer service-sales but very tough for manufacturing.

Wade

        -----Original Message-----
        From:   Gary Camac [SMTP:[log in to unmask]]
        Sent:   Tuesday, January 26, 1999 4:30 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] Laser depanelization

        Wade,
            I can't answer your question on laser cutting.  I do have
some questions for my on edification, if you
        have time to respond.

        How were the assemblies with the broken caps mechanically
separated?
        What is the type of capacitor?
        What  is the package size?
        What is the distance from the damaged parts to the score line?
        Is the long axis of the part parallel or perpendicular to the
score line?

        Wade Oberle wrote:

        > Dear Technetters,
        >         I have one panel with 120 units that I need to
depanelize via
        > laser.  The  board is already scored on both sides but the
customer
        > claims the capacitors are being damaged due to mechanical
        > depanelization.  They will only allow us to depanelize all 120
units
        > prior to double side assembly or run our normal assembly and
then use a
        > laser to singulate.  Can anyone help?  Is there a source for
'contract
        > laser singulation' for one board?
        >
        > Thanks in advance for your help.
        >
        > Wade Oberle
        > [log in to unmask]
        >
        >
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