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January 1999

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 16:29:49 -0600
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Wade,
    I can't answer your question on laser cutting.  I do have some questions for my on edification, if you
have time to respond.

How were the assemblies with the broken caps mechanically separated?
What is the type of capacitor?
What  is the package size?
What is the distance from the damaged parts to the score line?
Is the long axis of the part parallel or perpendicular to the score line?

Wade Oberle wrote:

> Dear Technetters,
>         I have one panel with 120 units that I need to depanelize via
> laser.  The  board is already scored on both sides but the customer
> claims the capacitors are being damaged due to mechanical
> depanelization.  They will only allow us to depanelize all 120 units
> prior to double side assembly or run our normal assembly and then use a
> laser to singulate.  Can anyone help?  Is there a source for 'contract
> laser singulation' for one board?
>
> Thanks in advance for your help.
>
> Wade Oberle
> [log in to unmask]
>
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