Gregory,
        I also work for a contract mfg.  When we have problems like this
and redesign isn't possible or can't be done in the time frame allowed,
we use a dot of adhesive between the pads.  When the board goes in for
reflow, the adhesive 'flash' cures enough to keep the part from moving
or tombstoning until the chip gets to the liquidus point.  Most
contractors are set up with a stencil printer and adhesive dispenser so
this is almost a 'free' operation.

Regards,

Wade

        -----Original Message-----
        From:   Parke, Gregory [SMTP:[log in to unmask]]
        Sent:   Tuesday, January 26, 1999 5:11 PM
        To:     [log in to unmask]
        Subject:        [TN] assy:AVX low inductance multilayer
capacitors

        Hi All,

        Does anyone have any experience with these parts?  We are
currently using
        two package styles of this particular part - the 0508 and the
0612 with some
        difficulty.  As you may have guessed the metalization is along
the long
        edges of the component and our subcontractor is having quite an
issue with
        tombstoning.  If people are using these components, what are the
pad sizes
        you are using? We having been using those pad sizes recommended
by the
        manufacturer.  Also, have you had any test failures due to
internal shorting
        of components?  Component specs are as follows:

        W=.080 +/- .010
        L=.050 +/- .010
        t= .005-.020 (terminal width)
        T= .030 max thickness
        _________________________________________
        Gregory Parke
        Manufacturing Engineer
        NetCore Systems, Inc.
        187 Ballardvale Street
        Wilmington, MA 01887
        (978) 694-1555 x 341            voice
        (978) 657-6555                  fax
        (888) 430-2925                  pager
        [log in to unmask]           e-mail
        _________________________________________

        ################################################################
        TechNet E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
        ################################################################
        To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
        To subscribe:   SUBSCRIBE TechNet <your full name>
        To unsubscribe:   SIGNOFF TechNet
        ################################################################
        Please visit IPC's web site (http://www.ipc.org) "On-Line
Services" section for additional information.
        For technical support contact Hugo Scaramuzza at [log in to unmask]
or 847-509-9700 ext.312
        ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################