Hi technetters ,
I sent this meesage on 31 of December . Probably most of you were out of
e-mail due to new year . This is the second trial .
What are the  existing and working technologies for electrolytic copper and
tin lead plating of blind vias , laser drilled ?
We are testing now making tests with   0.2 mm diameter , 0.3 mm deep laser
drilled vias . The stage of permanganate desmear and electroless copper
plating was performed in vertical line without special efforts . We tried
different current densities in vertical electrolylic stage , but we got very
poor copper distribution along the wall : 20 microns in the upper part , 5
microns on the bottom and on the lower part of the wall . We just presume ,
tha the same problem will be for tin-lead stage of pattern plating .
Best regards and Happy New Year 1999 !
Edward Szpruch
Eltek Ltd - Israel
e-mail :  [log in to unmask]

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