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January 1999

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Subject:
Re: Laser depanelization
From:
John Gulley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 16:06:56 -0800
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If there is, I want to know how they are and do they practice good ESD measures?

John Gulley

Wade Oberle wrote:

> Dear Technetters,
>         I have one panel with 120 units that I need to depanelize via
> laser.  The  board is already scored on both sides but the customer
> claims the capacitors are being damaged due to mechanical
> depanelization.  They will only allow us to depanelize all 120 units
> prior to double side assembly or run our normal assembly and then use a
> laser to singulate.  Can anyone help?  Is there a source for 'contract
> laser singulation' for one board?
>
> Thanks in advance for your help.
>
> Wade Oberle
> [log in to unmask]
>
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