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January 1999

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 17:27:22 EST
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In a message dated 1/26/99 2:02:37 PM Pacific Standard Time,
[log in to unmask] writes:

<< Dear Technetters,
         I have one panel with 120 units that I need to depanelize via
 laser.  The  board is already scored on both sides but the customer
 claims the capacitors are being damaged due to mechanical
 depanelization.  They will only allow us to depanelize all 120 units
 prior to double side assembly or run our normal assembly and then use a
 laser to singulate.  Can anyone help?  Is there a source for 'contract
 laser singulation' for one board?

 Thanks in advance for your help.

 Wade Oberle
 [log in to unmask] >>

Hi ya Wade!

     Laser? WOW! I might be wrong here, but ain't that just a little overkill?
I can understand not wanting to stress the caps, but a laser?

     You said that the panel was already scored, so I'm assuming that was done
by conventional means and that more than likely either the caps are located a
tad closer that they should be to the score, or that the score isn't deep
enough for whatever reason (fab house screw-up, or it wasn't specified deep
enough to begin with...).

     I had the same sort of problem a few weeks back with a consigned kit of
boards. Being consigned, we normally don't do incoming recieving inspection,
we just count em'. You can guess what happened. Built the bloody things but
couldn't get em' apart, so I did what was suggested to me by a scoring guru
out here in the bay area. Take a nice sharp exacto knife and go back over the
score lines a few times to get some additional depth, then try to separate
them...if it felt like there was too much stress taking them apart, I'd go
back over the score lines one more time. It worked like a charm! 'Course I
didn't have a bazillion panels to do, just 40...

-Steve Gregory-

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