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January 1999

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Subject:
From:
"Tynan, Cait Joy (Cait)** CTR **" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 25 Jan 1999 08:29:22 +1100
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text/plain
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Please delete my address from this list.

Regards

[log in to unmask]

> ----------
> From:         Guenter Grossmann[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Guenter Grossmann
> Sent:         Friday, 22 January 1999 22:31
> To:   [log in to unmask]
> Subject:      [TN] Dewetting on NiAu
>
> Hi all
>
> I have a request of a company working with us. They face the problem that
> their solder joints of QFP's on NiAu pad surfaces ( Au electroless plated
> )
> does not bond in the reflow process. Trials have been made with various
> suppliers of PCB's, all with the same result. All the other components
> seem
> to solder Ok. Has somebody else gone through this? Does somebody know the
> reason for the problem and maybe a solution?
> Thanks for your help.
>
> Best regards
>
>
> Guenter
>
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