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January 1999

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Subject:
Laser depanelization
From:
Wade Oberle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 15:51:27 -0600
Content-Type:
text/plain
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text/plain (26 lines) 
Dear Technetters,
        I have one panel with 120 units that I need to depanelize via
laser.  The  board is already scored on both sides but the customer
claims the capacitors are being damaged due to mechanical
depanelization.  They will only allow us to depanelize all 120 units
prior to double side assembly or run our normal assembly and then use a
laser to singulate.  Can anyone help?  Is there a source for 'contract
laser singulation' for one board?

Thanks in advance for your help.

Wade Oberle
[log in to unmask]

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