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January 1999

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Subject:
Re: Baking PCB With OSP Finish
From:
Andy Mackie <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 14:03:11 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines) 
Kevin: I don't have any personal experience, but I have heard from one
source that baking the boards at 130degC for about 12 hours in dry nitrogen
should do the trick. Make sure that you stagger the boards, or put some
kind of separators between them, so that the water molecules can diffuse
out. I hope this helps.

Andy Mackie, PhD
Praxair Inc.





Kevin Moore-G11208 <[log in to unmask]> on 01/26/99 10:59:03
AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Kevin Moore-G11208 <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Andy Mackie)
Subject:  [TN] Baking PCB With OSP Finish




     Can PCB with an OSP finish be baked to remove water?
     What temperature?
     What time?
     Will solderability degrade with baking?

     Thanks, Kevin Moore 847 480 5019,  [log in to unmask]

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