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January 1999

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Subject:
From:
"S.L.N.MURTHY" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 24 Jan 1999 21:22:01 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (146 lines)
Dear Ms. Cathy Alpin

I am one of the readers of your esteemed magazine. I have been in the line
of PCB design from the past 20 years and have to my credit setting up the
first few sites of integrated CAD solutions to PCB Design in large
establishments wherein I was working.

I set up this company a decade ago to provide services to the design
industry. I am actively involved in high-performance designs and high-speed
board designs. I have also conducte workshops on High-Speed design in this
country for the first time and we had participation from senior design
members belonging to Defence R&D, Multinationals like Texas Instruments,
ABB,and Govt.of India undertakings.

I would love to contribute an article to this magazine. Would appreciate, if
you can let me know the details as to how to prepare the material, in what
format the information need to be and has there been any articles on
"High-speed PCB Design" published in your magazine recently, if yes can I
have a copy of that to review where I stand in this direction.

Looking forward to your reply.

With warm regards

Murthy S.L.N

-----Original Message-----
From: Cathy Aplin <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, January 12, 1999 12:08 AM
Subject: [TN] Call for papers


>CALL FOR PAPERS
>The Editor invites prospective authors to submit original manuscripts for
>possible publication in Circuit World.
>
>Editorial Objectives and Guidelines
>
>Circuit World aims to provide a central authoritative, independent and
>international forum for the exchange of information pertaining to the
design
>and manufacture of Printed Circuit Boards (PCB)s and associated
>technologies.  It makes an important contribution to the technical body of
>knowledge and expertise in this crucial area, linking research to current
>practice and application.  The journal comprises a multi-disciplinary study
>of the various technologies, processes and current practices relating to
the
>design and manufacture of Printed Boards.  Among the broad range of topics
>covered are:    Single- and double-sided boards, Multilayer boards,
Flexible
>circuits, Vias/microvias, Lamination, Photoresistance, Process chemicals,
>Soldering, Drilling, Etchants, High speed PCBs, Controlled impedance,
>Cleaning, Environmental issues
>
>Circuit World's contributors, subscribers and readers are a mix of leading
>researchers, technical staff and practising engineers, both from within
>academia and PCB manufacturing and user industries and all academic
branches
>of engineering together with their information providers, academic,
>institutional, technical and corporate libraries.
>
>Article Presentation
>
>Material for publication is welcomed in the form of state of the art
>technical and research papers, case studies, experimental procedures,
review
>articles and short communications.  Articles should be between 3,000 and
>6,000 in length.  Articles should be typed with wide margins and double
>spacing.  Two copies should be sent to the Editor together with a brief
>autobiographical note, 1-6 keywords, an abstract of approximately 150 words
>and  a suggested title.  More detailed information can be found on the MCB
>Web site.
>
>Submission of disks
>
>Once an article has been accepted for inclusion within the journal, disks
>should be supplied with manuscript whenever possible.  Contributors in a
>position to comply with this request should submit any 3½" disk prepared on
>a PC or Macintosh system in ASCII format.  Mark the disk clearly with the
>author's name and title of the article.
>
>Copyright
>
>Authors submitting articles for publication warrant that the work is not an
>infringement of any existing copyright and will indemnify the publisher
>against any breach of such warranty.  Papers and contributions published
>become the legal copyright of the publisher, unless otherwise agreed.
>
>Review Procedure
>
>The Editor, in association with other the editorial advisory board and
>subject experts, reviews each paper for validity and general relevance to
>the publication.
>
>Submission of articles
>
>All manuscripts and editorial communications should be sent to the Editor:
>Dr John Lau, c/o MCB UP Ltd, 60/62 Toller Lane, Bradford, West Yorkshire.
>BD8 9BY, UK
>Telephone enquiries to Cathy Aplin (Managing Editor) at MCB UP Ltd:  +44
(0)
>1274 777700   E-mail: [log in to unmask] Fax: +44 (0) 1274 785200
>http://www.mcb.co.uk/mcbhome.htm
>
>News items should be forwarded to the Associate Editor, Trevor Galbraith at
>Electronics Marketing Ltd, Telephone +44 (0) 1624 835857, Fax +44 (0) 1624
>835889.
>
>
>Managing Editor
>Engineering, Materials Science and Technology Division
>MCB University Press
>60-62 Toller Lane, Bradford, West Yorkshire BD8 9BY, UK
>Tel: 44 (0) 1274 777700
>Fax: 44 (0) 1274 785200
>Email: [log in to unmask]
>
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