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January 1999

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Subject:
From:
Brinson Lonnie G CNIN <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Jan 1999 08:05:09 -0500
Content-Type:
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text/plain (32 lines)
I am having a problem with inspection of the above mentioned subject, My
branch has contracted to build the end item product for NAVSEA, The supplier
of the circuit cards sub-contracted the building of same. I have been doing
incoming inspection of the circuit cards and found numerous defects in the
area of side overhang exceeding 25% of the component pad. This area has
irritated the supplier to say the least, and has responded by saying that
the only inspection criteria that I can now use is by inspecting the leads
from the toe end of the leads,straight on and not from a top view that is
required because of the enourmous amount of surface mount components. The
inspection criteria for these circuit cards is per IPC-610, class 3, High
Performance Products. My question to you, "Is this the only way that I am
allowed to inspect the leads or am I allowed to inspect them from all angles
if necessary ?" and is this process documented in IPC-610 anywhere? Because
I can't seem to find it anywhere between the covers of the manual.

Lonnie Brinson
 Code 6072
 Bldg 2930
 854-2301

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