TECHNET Archives

January 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
FAB: Solder Filled Thermal Vias
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Jan 1999 18:35:46 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
You're obviously much too modest. Don't we all wish to express ourselves so well? I think you've got
part of it.

Earl Moon

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2