Dear Steve and Earl,
Thanx a lot for your helpful replies abt the above subject on the SMT-Net.
I wanted to post the same question on this mailing list too. I guess they
are different.

Hi Everyone,
We plan to build, for reliability/experimental/research purpose some CSPs
(namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch).
the various factors that we plan to evaluate are the reliability and
assembly concerns for four diff pad types: full microvia in pad, partial
via in pad, the dog bone and the normal circular pad design.
We also plan to play around with the permissible placement offsets that
these pads can take with allowable self centering.
I would really appreciate if anyone of u cud tell me the DOs and DONTs
before we embark on the experimental design. Also any type of trends that u
all have found for for similar experiments.
Thanks in anticipation
Regards


Parvez Patel
Graduate Research Associate
Universal Instruments Corporation
Binghamton-NY 13905
Ph: 607-779-7215

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