Hi group,

No body has mentioned the idea, but I began to ponder it as I saw all the responses.

How do solder-filled vias compare with larger, open vias regarding thermal? I began to wonder how open vias
will react when air is blown across the face of the board.  I've done thermal areas with >.020" open vias
in the past, but haven't been asked to do filled ones. And, I've always made sure the soldermask doesn't
cover the areas.

Won't the vias allow "cooler" air to pass from one side of the board to the other? Or even, with air being
forced across the board surface, would these open vias maybe increase the air velocity circulating around
these vias, causing it to cool better?

I'm not a thermal guy, so I don't know the answers.

Any comments?

Thanks,  Mitch
San Diego, CA

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