Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 22 Jan 1999 15:52:36 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
In a message dated 01/22/99 16:30:49, you wrote:
>Does anyone know about equipment to perform pull-test?
>We are interested in perform pull test to solder joints of
>QFP´s and BGA, in order to obtain their strength.
Hi Alejandro,
Most pull-test rigs are made in-house; but why do you want to run such tests?
While they will tell you whether or not you have good solder wetting, there
are better (and cheaper) ways of doing this—±and pull-tests do NOT tell you
anything about the reliability to be expected for these solder joints.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|