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January 1999

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Subject:
pull-test to QFP and BGA
From:
José Alejandro Becerra Chiu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 22 Jan 1999 14:04:18 -0600
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (28 lines) 
Hi Technetters:

Does anyone know about equipment to perform pull-test?
We are interested in perform pull test to solder joints of
QFP´s and BGA, in order to obtain their strength.

Thank you
           
Alejandro Becerra
Research assistant
Laboratory for Electronic Manufacturing
ITESM
Monterrey, N.L., Mexico
(8)3-58-20-00 Ext. 5122
[log in to unmask]

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