Hi All,
I would like to get such information,too.
-----原始郵件-----
寄件者: Thomas Colombo <[log in to unmask]>
收件者: [log in to unmask] <[log in to unmask]>
日期: 1999年1月22日 AM 02:44
主旨: [TN] Sequential lamination / Via Damming materials


>Is anyone working with any via damming materias in sequential lam. other
>than the industry standards ie: Senform, packovia, etc.
>
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