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January 1999

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Subject:
From:
Patranit Waitayasuwan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 22 Jan 1999 13:27:42 +0700
Content-Type:
text/plain
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text/plain (39 lines)
Dear  Sir,

        Refer  to  ANSI/J-STD-004  in detail of IPC-TM-650  Test Method No.
2.6.3.3  Surface   insulation  Resistance,Fluxes.  I  would   like  to ask
you  the  following   question:

1. Is  this  procedure  can  use  for  PCBA( Use  actual  PCBA  after  assy
as  the  sample  board)  because  I  understand  that   Test Method No.
2.6.3.3   use  for  identify   effect  of  flux  by  SIR  test  and  we
must  prepare  the  specimen  by  flux  which  we  want  to  test,  But  we
would  like   to  test  our  PCBA(finish  good)  Can  use  this  procedure
or  not?  Or  have  other  specific  method  for  SIR  test  of  residue  on
PCBA?

2.  We  can  use  the  following  item  for  test  all  type& dimension  of
sample(PCBA) ? :
        - test  condition(humidity,temperature)
        - test  pattern  size
        - other  parameter

Please  answer  my  question  and  thank  you  for  your  response.

Best  Regards,
Patranit



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