Hi Technetter,
Rick Hartley
I would like to attend this Seminar. Is there one coming to the San
Jose area in the near future.I would appreciate if you could give me
some leads here.
Sonia Singh
New Product Engineer
Access Network
Raychem
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From: "Tom Johnson" <[log in to unmask]>
To: "Keith Jensen" <[log in to unmask]>, <[log in to unmask]>,
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"Vince Beusan" <[log in to unmask]>,
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Subject: San Diego IPC Designers Council Meeting
Date: Mon, 18 Jan 1999 07:30:10 -0800
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Place: Ramada Inn.
5550 Kearny Mesa Road
San Diego, CA 92111
(619) 278-8000
Date: Jan. 21, 1999
Time: 6pm - 9pm
Cost: $5.00 for non IPC Designer Council Members.
Topic: EMI & Crosstalk Control at the board level.
Rick Hartley - Applied Innovation
The Issue!
When a time-varying (AC) current flows in a wire or conductor, both an
electric field and a magnetic field are present. These fields are the cause
of both EMI and Crosstalk. In recent years the effect of these fields has
increased in digital circuits due to increased device speeds (faster rise
and fall times). A device with a 1.0 nSec rising edge will likely have a 16
times greater EMI signature than a device with a 4.0 nSec rising edge.
The Solution!
There is no place in a circuit or system where we have better control of
these fields than at the PC board level. Gaining an understanding of what
generates these fields and how to control them and their effects will take
EMI and Crosstalk control from "guess work" to basic "everyday practice".
This 2+ hour presentation is a crisp and focused short course on the issues
PC board designers and Engineers need to know to resolve EMI and Crosstalk.
The topics include-
* Elements of EMI and Crosstalk.
* Circuit Properties - Frequency, Inductance, Capacitance and Current
Paths.
* Why EMI and Crosstalk are on the Rise.
* Differential and Common Mode EMI.
* Proper Power Distribution and Decoupling.
* Techniques to Control EMI and Crosstalk.
* Size and Position of Power Planes.
* Type and Location of Components.
* Signal Routing Techniques.
* PC board layer structuring (Board Stack).
* Grounding Techniques.
____________________________________________
Rick Hartley is a Senior PCB Hardware Engineer at Applied Innovation, a
provider of equipment to the telecommunications and Internet access
industry. His background is in the design of printed circuits for computers,
aircraft avionics and telecommunications. Rick's first high speed was in
1979. He has directed high speed digital and RF circuit board design, with
emphasis on EMI control, for the past 9 years. Rick has an Associate EE
Degree and 34 years of experience in the electronics industry. He has
functioned as a technician and circuit designer, dedicating the last 24
years to printed circuit design and development. Rick serves on the
IPC-D-275 and PC Card Subcommittees, the IPC Designers Council Executive
Committee, the Designer Certification Committee, is Chairman of the High
Speed Focus Module Committee and is co-founder and past president of the
Greater Ohio Chapter of the IPC Designers Council.
Please forward this mail on to others who might be interested.
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