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January 1999

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Subject:
From:
Seth Goodman <[log in to unmask]>
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Date:
Tue, 5 Jan 1999 16:08:32 -0600
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In looking for alternatives to HASL finished boards, several suppliers have
mentioned immersion white tin.  Since it is a conductive surface, whereas
OSP is not, the finished board can be electrically tested.  My question
concerns tin whisker growth.  Is this a problem for a chemically deposited
finish like this, or does this only occur with electroplated tin finishes?

What kind of experiences or opinions do folks have concerning immersion
white tin compared to OSP and immersion gold over nickel?

Seth Goodman
Goodman & Associates
7687 Leta Way
Verona, WI 53593
Tel (608)833-9933
Fax (608)833-9966

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