Hi there all you IPC guys, can someone help me to determine what the
best collection
of standard SMT land pattern designs is?

I use convection reflow on a QUAD machine for the majority and will
shortly be using wave solder on a BLUNDELL machine.

We are having a few problems that are being claimed as wrong footprint
sizes, and to be honest this could be true as
the footprints were not entered into our CADSTAR cad system in-house.

There seems to be little published material available in the U.K. as
complete documents to specify
sizes for the most commonly used devices & I was wondering if anyone
could tell me what the IPC-SM-782A
document is like ?

I.E. how many components does it cover & how much detail does it give
for each one ? Does it give clear differences
      between each soldering method & how good are these footprint
sizes?

Any footprints that have been designed in-house have come from differing
manufacturers data books that could
be out of date or the component could come from differing manufacturers.

Any help is appreciated.

T.T.F.N

Matthew Lamkin
Printed Circuit Board Draughtsman
Protec Fire Detection PLC
Churchill Way,
Nelson, Lancs
BB9 6RT.
Tel 01282 717393
Fax 01282 717273
Email = [log in to unmask]

Company Web Site = http://www.protec-fire-detection.plc.uk

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