Hi Jim

I just pulled one of our 4layer (do take bit more heat) cards random from
after wave ( a little Seho with foam > found spray too messy ) and :
The standard small pads you should be able to fill bottom easy ; barrel
you'll start to feel the climb (lesser mortals talk about 75% fill) ; the
top will sort out the wolfs from sheep : we manage all top pad fill on
standard pads ; but once you go to large pads with bigger than standard rim
you'll start to display outer golden rings ; say 0.2 - 0.5 mm rim ; on large
pads (heatsinks) just forget it ; you'll fill only the barrel ; which should

We use ancient Multi's X32 10i no clean ; I did have tendencies to upstyle
to Kest's etc. with perhaps more bitey composition ; but was never quite
forced enough to it .
Preheat some 150'C ; wave 240-250'C ; just about all ; both sides wave open
; deadly simple .

Have a fun Jim ; let us here know if you hit the wall ; always fancy gold's
versatility ; we have switchpads all over .

See yo'

Paul Klasek
http://www.resmed.com

> ----------
> From:         Jim Kittel[SMTP:[log in to unmask]]
> Sent:         Wednesday, 20 January 1999 8:40
> To:   [log in to unmask]
> Subject:      [TN] Gold Immersion at Wave Solder
>
> Technetter's,
> I have a question about immersion gold plating vrs HASL on thru hole
> boards to be wave soldered.
>
> We are currently using HASL and considering switching.  Is there any
> difference to be expected in top side wetting of gold vrs HASL?  Also,
> is there any significant difference in appearance between top side and
> bottom side solder fillet when using gold immersion?  Are their any
> other issues?
>
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