-----Original Message-----
From: Patten, James
Sent: Tuesday, January 05, 1999 11:58 AM
To: [log in to unmask]
Subject: RE: [TN] FAB: Solder Filled Thermal Vias
I've always wondered about the relative value of the practice of vias as
thermal movers. Comparing an adjacent free-panel or metallized copper plane,
it seems to me that if there is a relatively large metallized area, even the
next layer down, isn't the thermal resistance through a via sufficiently
large enough that the heat is going to "see" the metallized area before it
really even notices the via?. Just asking.
-----Original Message-----
From: Seth Goodman [mailto:[log in to unmask]]
Sent: Tuesday, January 05, 1999 10:42 AM
To: [log in to unmask]
Subject: Re: [TN] FAB: Solder Filled Thermal Vias
In going back and thinking about this (since I sometimes like to connect two
"radiating" areas of copper on opposite sides of the board with vias for
heat conduction), I wondered: solder is not a great heat conductor, but it
is better than air or solder mask, isn't it? What do you think would be a
good way to achieve a "thermal via"?
Seth Goodman
Goodman & Associates
7687 Leta Way
Verona, WI 53593
Tel (608)833-9933
Fax (608)833-9966
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
> Sent: Thursday, December 17, 1998 4:25 PM
> To: [log in to unmask]
> Subject: [TN] FAB: Solder Filled Thermal Vias
>
>
> I may be wrong interpreting your question, but it seems you want
> to get heat out. Are these vias
> "heat pipes?" If so, keep them open. As you know, solder is not a
> good thermal conductor.
>
> Earl Moon
>
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