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January 1999

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Subject:
From:
Rob Watson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Jan 1999 15:20:17 -0500
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Andrew,
You should consider running the side that is the least populated & fewest ICs first & apply heat-curing
glue dots between the pads of the chip components first, then after reflow, run the other side.  Be sure
not to apply too much glue so that when the component is placed it is squeezed onto the pads & end
terminations.  Hope this helps as a start.

Rob Watson
Sanmina Corp. Plant 10

Sherry, Andrew wrote:

> Hello,
>
> I am about to attempt to surface mount onto both sides of a board, having
> never attempted this before I wonder if anyone out there knows of any good
> reference materials or has any tips that might help me?
>
> Do you use two different pastes with different melting points and two passes
> in the oven or carriers to hold to underside components in place during
> reflow?
>
> Any info I would be grateful.
>
> Cheers
>
> Andrew Sherry
>
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