Hello Technetters,

Does anyone out there have any good guidelines (i.e., component temps, board
temps, solder joint temps, times) for reworking BGA's. The BGA I'm trying to
remove and replace is an ORCA (from Lucent) 432 perimeter PBGA that is on a
15X15 board that is 14 layers. I'm using a Pace Thermo-Flo unit with a
bottom side preheat. And I'm having a hard time getting a profile (plus I
don't have board to destroy). I am seeing bridging(via X-ray inspection) in
the corners of the component after reflow, or component and board warpage
during reflow, or if I keep the heat down opens in the circuit during test.
I know preheat is crucial but nothing I do seems to work. Help!!!

Thanks

Tim Stammely
MSI

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