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January 1999

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Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Jan 1999 13:04:00 -0500
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Hi Seth -

The folks at Enthone-OMI, DuPont Electronic Materials and Lackwerke/Peters all
supply via fill materials of varying thermal conductivities.  The advantage of
these materials over a solder filled via, is that they do not change when
subjected to soldering temperatures.  Believe me, a solder filled via which
disperses part of its contents under a large quad pack or similar can be a
mess to deal with.

Regards - Kelly

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