In the good old days (yesterday, or the day or year before), electroless copper deposition
depended on catalytic activity for adhesion to suitably drilled and prepared hole walls or
bare substrate surfaces. The catalyst of choice was palladium. It liked "attaching" itself to
organic materials as epoxies, etc. Once deposited, it left (when processes effectively
managed) a "sufficient" copper amount on which to electroplate copper. I never thought too
much about it until you brought it up, but may I be sure the catalytic chemistry precludes
its liking to plate to metallic surfaces.

Earl Moon

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################